Hermetic Packages
Material: Al-Si Alloys
Zuoyuan adopts rapid solidification and subsequent machining technology, offering a series of electronic packaging services,including R&D,production,subsequent machining and plating.
Product Details
Product Description
» RF/microwave housings & carriers;» T/R components;
» Amplifier Housings;
» Modules;
» Carriers;
» Other components.
Selectable Silicon Aluminum(Si/Al) Alloys
» AlSi27(Al-27%Si controlled expansion alloy);» AlSi50(Al-50%Si controlled expansion alloy);
» AlSi70(Si-30%Al controlled expansion alloy).
Advantages
» CTE match to circuit board and assembly components;» High thermal conductivity;
» Low density;
» Hermeticity;
» Good thermo-mechanical stability;
» High electrical conductivity(excellent EMI/RF shielding performance);
» Machinability,platability and compatible with microelectronic assembly technology.
AlSi Alloys Performance Parameters
Content wt% |
Density g/cm³ |
CTE 25℃ ppm/℃ |
Thermal Conductivity 25℃ W/mK |
Tensile Strength MPa |
Yield Strength MPa |
Poisson's Ratio |
Elongation % |
Elastic Modulus GPa |
Al-20%Si | 2.40 | 6 | 110 | 125 | 125 | -- | -- | 132 |
Al-27%Si | 2.6 | 17 | 175 | 170 | 130 | 0.29 | 3.8 | 91 |
Al-30%Si | 2.43 | 7.5 | 120 | 138 | 138 | 0.25 | <1 | 131 |
Si-40%Al | 2.46 | 9 | 125 | 181 | 181 | 0.27 | <1 | 121 |
Si-42%Al | 2.55 | 13.5 | 143 | 200 | 187 | 0.29 | 1 | 105 |
Si-50%Al | 2.5 | 11.5 | 140 | 200 | 210 | 0.28 | <1 | 108 |
Grade | Density g/cm³ |
CTE ppm/℃ |
Thermal Conductivity W/mK |
Tensile Strength MPa |
Yield Strength MPa |
Poisson's Ratio |
Elongation % |
Elastic Modulus GPa |
ZY-4047 | 2.66 | 21.6 | 193 | 208 | 129 | 0.33 | 18 | 70 |
ZY-6061 | 2.7 | 22.6 | 210 | 312 | 270 | 0.33 | 12.5 | 69 |
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