Hermetic Packages

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Hermetic Packages

Material: Al-Si Alloys


Zuoyuan adopts rapid solidification and subsequent machining technology, offering a series of electronic packaging services,including R&D,production,subsequent machining and plating.
 

Product Details

Product Description

 »  RF/microwave housings & carriers;
 »  T/R components;
 »  Amplifier Housings;
 »  Modules;
 »  Carriers;
 »  Other components.

 

Selectable Silicon Aluminum(Si/Al) Alloys

 »  AlSi27(Al-27%Si controlled expansion alloy);
 »  AlSi50(Al-50%Si controlled expansion alloy);
 »  AlSi70(Si-30%Al controlled expansion alloy).

 

Advantages

 »  CTE match to circuit board and assembly components;
 »  High thermal conductivity; 
 »  Low density;
 »  Hermeticity;
 »  Good thermo-mechanical stability;
 »  High electrical conductivity(excellent EMI/RF shielding performance);
 »  Machinability,platability and compatible with microelectronic assembly technology.

 

AlSi Alloys Performance Parameters

 
Content
wt%
Density
g/cm³
CTE
25℃
ppm/℃
Thermal 
Conductivity

25℃ W/mK
Tensile 
Strength

MPa
Yield 
Strength

MPa
Poisson's 
Ratio
Elongation
%
Elastic  
Modulus   
GPa 
Al-20%Si 2.40 6 110 125 125 -- -- 132
Al-27%Si 2.6 17 175 170 130 0.29 3.8 91
Al-30%Si 2.43 7.5 120 138 138 0.25 <1 131
Si-40%Al 2.46 9 125 181 181 0.27 <1 121
Si-42%Al 2.55 13.5 143 200 187 0.29 1 105
Si-50%Al 2.5 11.5 140 200 210 0.28 <1 108
 
Grade Density
g/cm³
CTE
ppm/℃
Thermal 
Conductivity

W/mK
Tensile 
Strength

MPa
Yield 
Strength

MPa
Poisson's 
Ratio
Elongation
%
Elastic  
Modulus   
GPa 
ZY-4047 2.66 21.6 193 208 129 0.33 18 70
ZY-6061 2.7 22.6 210 312 270 0.33 12.5 69
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